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Blind Via Filling Additive CVP-99

The series of micro plating copper additive CVP-99 is specially research the ability of high acid low copper and good throwing power for micro blind PCB. The good effect can be achieved both blind via and through-hole by only DC plating and settle our customers trouble on thon copper plating in blind via. For its stable bath solution, less decomposition, it is a must- have product for blind via copper plating. Furthermore, the additive can be analyzed and controlled by CVS.

  • Product Features
  • Product Advantage


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Excellent physical performance: elongation≥20%

Excellent heat resistance: 288℃,10s/5 times

Thermal cycling more than 500 times

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The diameter of hole: 105um

The depth of hole: 78um

Aspect ratio: 1:0.75

Throwing power: 94%

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Board thickness: 2.0mm

The diameter of hole: 0.25mm

Aspect ratio: 8:1

Throwing power: 92%


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