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Blind Via Filling Additive CVF-100
Blind via filling additive CVF-100 series by ZTW manufactured is specially developed for IC package substrate, high level HDI with a quick filling ability and good reliability. It can exactly fulfill the demand of micro via filling and mixed through-hole electroplating.
- Product Features
- Product Advantage
1．Excellent physical performance elongation≥20%
2．Excellent heat resistance: the thermal cycling more than 500 times
3．Can meet blind via hole diameter(70um-175um)
4．Ultra-thin surface copper: 15um
5．Perfect filling ability: dimple<10um
6．High current density and quick filling action
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| High level HDI picture | Pore diameter: 12um Hole depth: 83um the thickness of copper layer: 15um Dimple: 6.3um |